Sun Microsystems X4600 Uživatelský manuál stáhnout pdf (Strana 19)

Sun Microsystems, Inc.

Figure 2-5: Dual-Core AMD Opteron Processor Architecture

Note: Sun Fire X4600 servers support 95 W and 120 W 90 nm technology package infrastructure AMD Opteron Rev E and

Rev F processors only.

CPU Packaging

AMD Opteron 800 series processor packaging specifications include:

• 940-pin lidded organic micro PGA

• 1.27 mm pin pitch

• 31 x 31 row pin array

• 40 mm x 40 mm organic substrate

• Organic C4 die attachment

• 16.5 mm x 11.3 mm die size

AMD Opteron 8000 series processor packaging specifications include:

• 1207-pin organic land Grid Array (OLGA)

• 1.1 mm pin pitch

• 35 x 35 row pin array

• 40 mm x 40 mm organic substrate

• Organic C4 die attachment

• 16.5 mm x 11.3 mm die size

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Sun Microsystems X4600 Uživatelský manuál Strana 19